FC-BGA is a highly-integrated package board used to connect a high-integration semiconductor chip to a main board.
The company will spend the investment in phases until 2023 to build the new FC-BGA production line.
According to the plan, the Vietnamese subsidiary will focus on producing FC-BGA while Samsung's factories in Suwon City (Gyeonggi) and Busan City will specialise in technology development and high-end products.
