The company's President and CEO Tindaro Danze said the country is also in a position to lead in building greater sustainability in this field such as wafer fabrication and integrated circuit (IC) design.
According to him, the Asia Pacific semiconductor market is projected to enjoy double-digit growth in 2024, with demand is growing, and Malaysia is in a position to fill those orders.
Last year, Malaysia secured 13% of the global manufacturing testing market share and exported nearly 580 billion MYR (123.4 billion USD) in semiconductor products.
Danze said as Malaysia becomes entrenched as a global semiconductor hub, the integration of next-gen AI-enabled technologies is creating new opportunities for advancement in an industry already rife with innovation.
